Modélisation et simulation du limiteur de courant supraconducteur

Abstract

Considering the increase of the fault current level in electrical network, the current limiters become very interesting. The superconducting limiters are based on the quasi-instantaneous intrinsic transition from superconducting state to normal resistive one. Without detection of default or given order, they reduce the constraints supported by electrical installations above the fault. This thesis is focused on the modeling of high-temperature superconductor materials, and in particular, modeling of superconducting fault current limiter. Creating a simulation model which describes the behavior of superconducting fault current limiter is an essential key to the development of the applications in the industrial field, this in order to optimize the performances of the device and to improve the quality of the product for its commercial exploitation. This work is divided into two distinct parts: initially, we are interested in comprehension of the phenomenon of transition in the superconducting fault current, for there we develop a model that we wash named electric model, to simplify the validation of this model we wash integrated firstly in a single-phase network, the simulation results are proven simplicity and effectiveness of this model, follows we generalized this model with the three-phase system, with the integration of this model in the library of Matlab simulink. Then, we focus on the modeling of electro-thermal superconducting fault current limiter system. For this purpose we develop a thermal model. This model is useful for studying of the heating process inside the superconducting fault current limiter. In this model we used in the new generation of superconducting materials or coated conductors. The results can be used in order to optimize the performances of the device according to specific criteria. Thus we have proposed a modification of the geometry to avoid a possible thermal runaway which could lead to the destruction of the SFCL. The obtained results can be used to optimize a device according to specific criteria. In particular, we have proposed geometric modifications for avoiding possible local thermal runaway, which can lead to the destruction of the device.